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Inventory Management

OX3's inventory management services relieve your manufacturing team of the burden and cost of managing inventories. We provide the space, systems, and personnel to manage your inventory efficiently.

Here are advantages to having your inventory outsourced to OX3 Corporation:
  1. Secure space for your stock.
  2. Fully bonded.
  3. Sophisticated software systems.
  4. Custom reporting.
  5. Programming, taping, baking, dry-packing.
  6. Lead reconditioning, BGA Reballing.
  7. Both SMT and Thru-hole technologies.
  8. Multiple valuation methods, (LIFO, FIFO, etc.).
  9. Effective purge of obsolete components.
  10. Cycle counts and ABC counts.
  11. ESD Control.
  12. Delivery and Pick-up.
  13. Registered to ISO 9001:2000 since 2001.
  14. Moisture-barrier vacuum-seal control, [See: Baking]
                               Link to popular devices
                              

Axial, BQFP, CBGA, CCGA, CERDIP, CERQUAD, Chip Resistors, Chip Capacitors, CLCC, Connectors, CPGA, CQFP, Crystal, CSOJ, DFN, DIP, DPak, DQFN, DSBGA, FBGA, FET, Flatpack, GDIP, Heatsink, HSSOP, KDIP, LDCC, LGA, LLCC, LSOJ, LTCC, MSOP, Oscillator, PBGA, PDIP, PFP, PGA, PKDIP, PLCC, PQFP, QCC, QFN, QVSOP, Radial, SIP, SKPQ, SKSJ, SMCG, SMC, SOD, SOIC, SOJ, SOT, SQFN, SSOP, TBGA, TFSON, TQFN, Transistor, TSOJ, TSOP1, TSOP2, TSSOP, USON, Zip,


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