FBGA Fine-Pitch Ball Grid Array. These are BGA packages with grid pitches less than 1.0 mm. These devices use Flip-Chip interconnect technology and are sometimes called Chip Scale Packages. The solder balls typically consist of Eutectic lead/tin solder. FBGA Quote Tape and Reel for this FBGA. FBGA Find Carrier Tape to fit this FBGA. FBGA Buy Reels and Cover Tape to package this FBGA. FBGA Go to JEDEC for more Information on FBGAs. Thanks for choosing OX3 for all your semiconductor handling requirements. At any time, feel free to call Customer Support at (978) 772-1222 for assistance or fill out our Contact Form.

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