TBGA Tape Ball Grid Array. TBGA packages are made from strips of Polyamide tape. A metal plate stiffener is incorporated on top of the package for added strength. The nominal solder ball diameter for high melt solder balls is 0.63 mm and 0.60mm for low melt. TBGA Quote Tape and Reel for this TBGA. TBGA Find Carrier Tape to fit this TBGA. TBGA Buy Reels and Cover Tape to package this TBGA. TBGA Go to JEDEC for more Information on TBGAs. Thanks for choosing OX3 for all your semiconductor handling requirements. At any time, feel free to call Customer Support at (978) 772-1222 for assistance or fill out our Contact Form.

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